The THEMOS mini true thermal emission microscope system provides faster, more accurate localization through high pattern resolution and true thermal sensitivity. Improved true thermal sensitivity is achieved through the use of an InSb detector with spectral response covering the true thermal black body radiation range of 3-5 µm, the use of lock-in thermography technique and of Hamamatsu designed macro and micro lenses. A small prober system for wafer up to 200mm is used for sample fixture. It allows to analyze wafers and dies up to 200mm diameter from frontside as well as packaged devices from font- and backside. The thermal signal is imaged through 3 high N.A:, long working distance lenses with 0.8x, 4x and 15x magnification. This allows to obtain a pattern signal and the thermal signal through the same lens. Lock-in Thermography is a new approach to acquire thermal images at highest sensitivity. THEMOS mini with lock-in thermography option allows to supply a modulated electrical signal to the DUT and acquire the thermal signal in lock-in mode. Image processing has been exteded to get amplitude and phase image information. Typically phase image is very useful to detect faint thermal signals.

• Analysis on packages, packaged ICs , dies and wafer
• Tester cable docking
• Powerful 0.8x macro lens
• Long working distance microscope lenses 4x and 15x
• Frontside and backside capability
• True thermal 3-5 µm response
• Optional Lock-in thermography

• Short circuit of metalization
• Abnormality of contact holes
• Microplasma leakage in oxide layer
• Temperature mapping of semiconductor materials and PC boards
• Short circuit in packages

• Themos 1000
• Phemos

• Temperature measurement function U11389