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Electro- and Photoluminescence analysis

Detection of luminescence signals from wafer, solar cells and solar panels have become major techniques for characterization and quality inspection. They are applied for silicon based solar detectors as well as for thin film and organic devices.

Two methods are applied:

  • Electroluminescence (EL)
  • Photoluminescence (PL)

Hamamatsu offers a complete Luminescence Analysis system as well as individual cameras for luminescence imaging.

About Electroluminescence technique

When applying a forward biased voltage to a photovoltaic device or illuminating it with light, a weak amount of light can be detected, which originates from light emitted by minority carrier recombination. The amount of the light can be quantitatively analyzed to characterize carrier lifetime and sheet resistance. The spatial distribution indicates defects (such as micro-cracks), material inhomogeinities, delaminations and many other phenomena which are all relevant for the quality of photovoltaic detectors. The recombination radiation is typically centered in the near infrared wavelength region. In case of silicon materials it is centered at 1100 nm.

When applying a reversed bias voltage to a photovoltaic device, weak light signals can be detetected even below its break down voltage level caused by defects (e.g. shunts) of a solar device.

About Photoluminescence technique

When light is shining on a semiconductor (excitation),  a photoluminescence signal is generated (emission). By spectrally separating the excitation and emission signal and imaging the luminescence signal by a sensitive camera, characterisation and defect analysis of raw bulk material, wafers in process, finished cells is possible.

Cell efficiency, material properties, process failures or cracks can be analyzed.

Cameras for luminescence analysis 

For these applications highly sensitive cameras are required. In order to meet the varying demands of cell and panel inspection in quality assurance as well as in basic research, a broad line of products is offered. All cameras are optimized towards high sensitivity in the near infrared range.

 

Part Number
 
Name of product
 
Wavelength (min.)
 nm  
Wavelength (max.)
 nm  
Active pixels
 
Frame rate (max.)
 fps  
Data interface
 
C10633-34   Near Infrared Camera 900 1520 640 (H) x 512 (V) 1.6 RS232C
C10633   Near Infrared Camera 900 1520 320 (H) x 256 (V) 60 USB 2.0
C10600-10B (ORCA-R2)   ORCA-R2 300 1050 1344 (H) x 1024 (V) Max. with binning, sub-array: 115.1 IEEE 1394b
C9100-14 (ImageM-1K)   ImagEM-1K (Back-Thinned Electron Multiplier CCD Camera) 350 1050 1024(H) x 1024(V) Fastest in EM-CCD mode (with binning and subarray) 9.5fps to 231 Camera link
C9100-13    ImagEM (Back-Thinned Electron Multiplier CCD Camera) 350 1050 512(H) x 512(V) Fastest in EM-CCD mode (with binning and subarray) 31.9 fps to 404 Camera link
C8800-21C   Digital CCD Camera, cooled, 1k x 1k. 30Hz 400 1050 1000(H) x 1000(V) 30 Camera Link
C8484-05G02 (ORCA-05G)   Digital CCD Camera, cooled 300 980 1344 (H) x 1024(V) 43 (with binning) IEEE 1394
C8484-03G02 (ORCA-03G)   Digital CCD Camera, cooled 300 980 1344(H) x 1024(V) 43 (with binning) IEEE 1394
Part Number
Name of product
Wavelength (min.)
Wavelength (max.)
Active pixels
Frame rate (max.)
Data interface
 
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