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X-ray TDI Cameras

Learn more about TDI applications: View the TDI Solutions brochure

Learn more about X-ray TDI cameras: View the C10650 Series X-ray TDI camera catalog

The C10650 series X-ray TDI camera is useful for in-line applications requiring high-speed operation with high sensitivity.

banner see how it works
TDI is a special image acquisition method that has been used extensively in machine vision applications for industrial inspection. TDI imaging is appropriate for applications where a linear process is being recorded over time or where the aspect ratio of the subject is significantly asymmetric.

Low brightness under high resolution usage, a problem with conventional line sensor cameras, is improved with this X-ray TDI camera making it suitable for applications which require high resolution.

Image Gallery

Please click on the images below to see examples of the high-resolution images the C10650 series can capture.

Battery Resolution
Chart
IC Image IC void
X-ray TDI Camera + Microfocus X-ray Source (MFX)
(X 2 time magnification)
200% of digital zoom
20 Line Pair / mm = 25 μm (Resolution)
X-ray TDI Camera + Microfocus X-ray Source (MFX)
(X 2 time magnification)
X-ray TDI Camera + Microfocus X-ray Source (MFX)
(X 2 time magnification)
The back fillet uder the IC can be inspected using X-ray.
X-ray TDI Camera + Microfocus X-ray Source (MFX)
(X 2 time magnification)
The void under a heat radiating fin can be detected.

Hamamatsu also manufactures standard and dual-energy x-ray line scan cameras. For more information about these products, please visit our web pages about X-ray Line Scan Cameras.

 

Part number
 
CCD pixel number
 
CCD pixel size
µm  
CCD active area
 
X-ray
sensitive
area
mm  
Window
 
X-ray
detection
range
kVp  
X-ray
tolerance
range
W (max)  
TDI
line
rate
KHz  
C12200-321    4608(H) x 128 (V) 48 µm x 48 µm 221 mm (H) x 6mm (V) FOS approx. 25 kV to 130 kV 130 kV, 80 µA (max) 1 x 1 - Maximum 8 kHz (23.040 m/min)
binning 2 x2 - Maximum 6.4 kHz (36.864 m/min)
C10650-461   6144 (H) x 128 (V) 48 µm x 48 µm 292 mm (H) x 6mm (V) FOS approx. 25 kVp to 85 93.5 kVp, 50 1 x 1 - Maximum 2.109 kHz (6.514 m/min)
binning 2 x2 - Maximum 1.858 kHz (11.381 m/min)
C10650-321   4608 (H) x 128 (V) 48 µm x 48 µm 221 mm (H) x 6mm (V) FOS approx. 25 kVp to 85 93.5 kVp, 50 1 x 1 - Maximum 2.109 kHz (6.514 m/min)
binning 2 x2 - Maximum 1.858 kHz (11.381 m/min)
C10650-221   3072 (H) x 128 (V) pixel format x 2 chips 48 µm x 48 µm 146 mm (H) x 6 mm (V) FOS approx. 25 kVp to 85 93.5 kVp, 50 1 x 1 - Maximum 2.109 kHz (6.514 m/min)
binning 2 x2 - Maximum 1.858 kHz (11.381 m/min)
Part number
CCD pixel number
CCD pixel size
CCD active area
X-ray
sensitive
area
Window
X-ray
detection
range
X-ray
tolerance
range
TDI
line
rate
 
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